1. 2. 3. material content data sheet sales product name idw30e60 issued 29. august 2013 ma# MA000957204 package pg-to247-3-41 weight* 6045.70 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.205 0.02 0.02 199 199 leadframe non noble metal iron 7439-89-6 0.530 0.01 88 inorganic material phosphorus 7723-14-0 0.159 0.00 26 non noble metal copper 7440-50-8 529.068 8.75 8.76 87512 87626 wire non noble metal aluminium 7429-90-5 8.862 0.15 0.15 1466 1466 encapsulation organic material carbon black 1333-86-4 20.013 0.33 3310 plastics epoxy resin - 380.254 6.29 62897 inorganic material silicondioxide 60676-86-0 1601.069 26.48 33.10 264828 331035 leadfinish non noble metal tin 7440-31-5 31.874 0.53 0.53 5272 5272 plating non noble metal nickel 7440-02-0 29.065 0.48 0.48 4807 4807 solder non noble metal antimony 7440-36-0 0.112 0.00 18 noble metal silver 7440-22-4 0.279 0.00 46 non noble metal tin 7440-31-5 0.726 0.01 0.01 120 184 heatspreader inorganic material phosphorus 7723-14-0 1.033 0.02 171 non noble metal iron 7439-89-6 3.442 0.06 569 non noble metal copper 7440-50-8 3438.006 56.87 56.95 568671 569411 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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